Pick & Place System
System introduction
Pick & Place System은 정밀 Motion Control과 Vision Alignment 기술을 기반으로 제품의 위치를 정확하게 인식하고, 원하는 위치로 안정적으로 이송 및 배치할 수 있도록 설계되었습니다.
초소형 300μm 이하 Photo Diode(PD) Chip을 대상으로, Expanding Grip Ring 상에서 고객이 원하는 위치에 고속·고정밀 Pick & Place를 구현하는 Advanced Chip Transfer System입니다. 고정밀 위치 제어 기술을 기반으로 미세 Chip Handling 공정의 생산성과 작업 효율을 향상시킵니다.
Pick & Place System
System introduction
The Pick & Place System combines precision motion control and vision alignment to recognize product position accurately and transfer and place parts reliably.
Designed for photodiode (PD) chips smaller than 300 µm, it performs high-speed, high-precision pick-and-place from an expanding grip ring to customer-defined locations. Precision positioning improves productivity and efficiency in micro-chip handling.
Specification
| Chuck Size | 100mm |
|---|---|
| Chuck Material | Nickel plated |
| Stage Stroke | XY Axis(200mm)Z Axis(10mm) , Theta(Fine theta manual movement ± 3°) |
| Optic Stage Stroke | XYZ Axis(±50mm) |
| Isolation Table | 3 Auto Leveling Valve, Natural Frequency of System : Vertical : 1.2~1.5Hz |
| Optic Unit | 4 or 5Hole Turret, Probing View Camera |
| Size | (W)960 x (D)985 x (H) 1,800 |
| Utility | CDA(0.5MPa), Vacuum(50KPa) |
| Chuck Size | 100mm |
|---|---|
| Chuck Material | Nickel plated |
| Stage Stroke | XY Axis(200mm)Z Axis(10mm) , Theta(Fine theta manual movement ± 3°) |
| Optic Stage Stroke | XYZ Axis(±50mm) |
| Isolation Table | 3 Auto Leveling Valve, Natural Frequency of System : Vertical : 1.2~1.5Hz |
| Optic Unit | 4 or 5Hole Turret, Probing View Camera |
| Size | (W)960 x (D)985 x (H) 1,800 |
| Utility | CDA(0.5MPa), Vacuum(50KPa) |